diaphragm Membrane

classification

Content

is installed inside the CMP carrier head and is used for multi-zone independent pressure control of the elastic diaphragm assembly.

in the grinding process, the independent pressure control of each region in the radial direction of the wafer is realized.

precision control object: MRR (material removal rate), WIWNU (on-chip non-uniformity)

working principle

Pneumatic system & rarr; Multi-zone independent air chamber & rarr; Elastic diaphragm & rarr; When differential pressure is applied to the back of the wafer, the diaphragm produces micron-scale micro-deformation.

locally adjusting the contact pressure of the wafer to the polishing pad & rarr; changes the MRR of this region.

results: precise control of radial removal rate distribution.

Core process index

MRR (material removal rate)

WIWNU (Intra-chip Non-uniformity)

WTW (inter-chip uniformity)

Edge Loss Minimization

Defect/Scratch Risk Management

5 Zone Structure Example

Center Area-Center Pressure Control

Middle Zone-Middle Radius Zone

Edge Zone-Edge Pressure Control

Guard Ring Area-Guard Ring Adjacent Area

Back Area-Back Pressure Stabilization

※ high-end equipment can be expanded to Zone 6/Zone 7

Customer Value

Radial Removal Rate Precise Control

Meet the uniformity requirements of advanced node process

Minimize edge over-grinding

improves process yield and repeatability