Product Title
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classification |
Content |
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Product overview |
PVA (polyvinyl alcohol) porous brush roller used in the post-CMP (chemical mechanical polishing) cleaning module is used to efficiently remove the residual polishing slurry (Slurry) and fine particles on the wafer surface, thereby improving the process yield. |
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Applicable equipment |
Applied Materials(Applied Materials) Lam Research(Pan-Lam Group) EBARA(Ebara) |
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Main Functions |
-Efficient particle removal capability -Minimize surface damage (low defect/low scratch) -Excellent chemical cleaning compatibility -compatible with 200mm / 300mm wafer |
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Product Features |
-connected porous structure (Interconnected Porous Structure) -can be customized aperture and structure design -Excellent hydrophilicity and flexibility -High chemical resistance and mechanical strength -with anti-static performance -No chip drop/low particle release design (Lint-Free / Particle-Free) -Long service life (Long Lifetime) |
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Customer Expected Revenue |
-Prevent particles from reattaching -Reduces defect rate and improves yield -Improve process stability -Reduced maintenance and operating costs |
